A fibre system specifically designed for ultra high density data centre applications
Nexans announced the launch of its new ultra high density LANmark-OF ENSPACE solutions for data centres. The range includes patch panels, cables and connectors which will help data centres meet the growing data demands.
The new range of fibre panels features three individual sliding trays per height unit (â€˜Uâ€™). This format supports 144 LC connections per â€˜Uâ€™ and each individual tray can be pulled forward to allow access for installing or disconnecting cords.
ENSPACE supports both LC & MTP pre-terms providing scalability, while the pre-term cables feature Nexansâ€™ tiny Micro-Bundle cable design which can contain 96 fibres in a cable with a diameter of just 6.4 mm to save containment space. Patch cords feature highly flexible, bend insensitive fibre to accommodate the high density patching.
- 144 LC connections per ‘U’
- LC & MTP pre-terms supported
- 10, 40, 100Gb/s and beyond
- Fingertip access patching
- Easy addition of ports
Joost Grillaert, Product Manager for Fibre LAN systems at Nexans Cabling Solutions: â€œThe development of LANmark-OF ENSPACE was the logical next step for us and we have been refining it, by co-development with a large customer in the financial sector. ENSPACE brings a number of benefits to the end-user by optimising space usage and cable management. With ENSPACE we can offer end-users a fibre cabling solution that is able to reduce rack space by 50% compared to conventional fibre systems.â€
â€œWe are pleased to launch LANmark-OF ENSPACE for our customers in the Middle East. With the increased uptake of trends such as IoT, digitisation, cloud, big data and mobility, organisations need to ensure that their data centres are equipped to meet the growing data demands. With LANmark-OF ENSPACE, we are confident our customers will find the ideal cable management solution for their data centre needs,â€ said Tarek Helmy, Regional Director Gulf and Middle East, South & East Africa at Nexans Cabling Solutions.